Patent Assignment
Reel/Frame 059964/0971
Assignment of Assignor's Interest
Recorded: 2022-05-19
Pages: 5
Assignors
CHEN, YI-JUNG
Executed: 2022-05-05
TSAI, TSUNG-FU
Executed: 2022-05-05
LU, SZU-WEI
Executed: 2022-05-05
TSAO, WEI-AN
Executed: 2022-05-04
YANG, CHE-YUAN
Executed: 2022-05-04
CHEN, CHIEN-TING
Executed: 2022-05-05
HUNG, CHIH-CHIEH
Executed: 2022-05-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Lens Structure and Manufacturing Method Thereof
Application:
17/743,463 →
Publication:
US 2023/0369370