Patent Assignment
Reel/Frame 059970/0663
Assignment of Assignor's Interest
Recorded: 2022-05-20
Pages: 4
Assignors
CHEN, WEI-CHIH
Executed: 2019-11-25
CHEN, SHI-CHI
Executed: 2019-11-25
WANG, TING-WEI
Executed: 2019-11-25
WANG, JEN-TI
Executed: 2019-11-26
CHUANG, KUO-FONG
Executed: 2019-11-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Transporting Wafers