Patent Assignment
Reel/Frame 059977/0095
Assignment of Assignor's Interest
Recorded: 2022-05-20
Pages: 3
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., ZHONGLI DIST., TAOYUAN CITY, 320, TAIWAN
Covered Property
(1)
Chip Package and Manufacturing Method Thereof