Patent Assignment
Reel/Frame 059988/0202
Assignment of Assignor's Interest
Recorded: 2022-05-12
Pages: 3
Assignor
WYNNE, THOMAS MIKIO
Executed: 2022-01-21
Assignee
CORNING INCORPORATED
ONE RIVERFRONT PLAZA, CORNING, NEW YORK, 14831
Covered Property
(1)
Method of Bonding Substrates and Separating a Portion of the Bonded Substrates Through the Bond, Such as to Manufacture an Array of Liquid Lenses and Separate the Array into Individual Liquid Lenses