Patent Assignment
Reel/Frame 059999/0093
Assignment of Assignor's Interest
Recorded: 2022-05-24
Pages: 3
Assignors
LEE, JUNG NAM
Executed: 2022-05-19
YUN, SUNGHOON
Executed: 2022-05-19
SEO, JANGWON
Executed: 2022-05-19
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Adhesive Film for Polishing Pad, Laminated Polishing Pad Including the Same and Method of Polishing Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.