IP Library Assignment 065509/0991
Patent Assignment
Reel/Frame 065509/0991

Change of Name

Recorded: 2023-11-09 Pages: 9
Assignor
SKC SOLMICS CO., LTD.
Executed: 2023-11-03
Assignee
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF
Covered Properties (32)
Boron Carbide Sintered Body and Etcher Including the Same
Application: 16/536,478 →
Publication: US 2020/0062654
Ring-Shaped Element for Etcher and Method for Etching Substrate Using the Same
Application: 16/536,602 →
Publication: US 2020/0051793
Polishing Pad, Method for Manufacturing Polishing Pad, and Polishing Method Applying Polishing Pad
Application: 16/584,081 →
Publication: US 2021/0094143
Semiconductor Process Polishing Composition and Polishing Method of Substrate Applied with Polishing Composition
Application: 17/563,499 →
Publication: US 2022/0208552
Blank Mask and Photomask Using the Same
Application: 17/567,478 →
Publication: US 2022/0206380
Blank Mask and Photomask Using the Same
Application: 17/567,618 →
Publication: US 2022/0214609
Blank Mask and Photomask Using the Same
Application: 17/729,419 →
Publication: US 2022/0357647
Photomask Blank and Photomask Using the Same
Application: 17/729,466 →
Publication: US 2022/0350237
Photomask Blank, Photomask, and Manufacturing Method of Semiconductor Element
Application: 17/733,103 →
Publication: US 2022/0350238
Blank Mask and Photomask Using the Same
Application: 17/749,387 →
Publication: US 2022/0382141
Adhesive Film for Polishing Pad, Laminated Polishing Pad Including the Same and Method of Polishing Wafer
Application: 17/751,942 →
Publication: US 2022/0380644
Apparatus for Mixing Resin Composition for Manufacturing Polishing Pad and Method of Manufacturing Polishing Pad
Application: 17/751,947 →
Publication: US 2022/0379275
Blank Mask and Photomask Using the Same
Application: 17/834,279 →
Publication: US 2022/0397819
Polishing Composition for Semiconductor Process and Manufacturing Method for Polished Article
Application: 17/859,301 →
Publication: US 2023/0019730
Blank Mask and Photomask Using the Same
Application: 17/862,508 →
Publication: US 2023/0030141
Ceramic Component and Method of Manufacturing Ceramic Component
Application: 17/884,892 →
Publication: US 2022/0380262
Ceramic Component and Plasma Etching Apparatus Comprising Same
Application: 17/884,926 →
Publication: US 2022/0380263
Method of Cleaning Substrate for Blank Mask, Substrate for Blank Mask, and Blank Mask Including the Same
Application: 17/888,726 →
Publication: US 2023/0064333
Manufacturing Method of Ring-Shaped Element for Etcher
Application: 17/892,425 →
Publication: US 2022/0406574
Blank Mask and Photomask Using the Same
Application: 17/898,749 →
Publication: US 2023/0083755
Blank Mask and Photomask Using the Same
Application: 17/960,214 →
Publication: US 2023/0110529
Method and Apparatus for Manufacturing a Photomask from a Blank Mask
Application: 17/980,313 →
Publication: US 2023/0135120
Blank Mask and Photomask Using the Same
Application: 17/980,840 →
Publication: US 2023/0135037
Laminate for Blank Mask and Manufacturing Method for the Same
Application: 17/994,739 →
Publication: US 2023/0168574
Method of Preparing Laminate and Laminate for Optical Use
Application: 18/080,176 →
Publication: US 2023/0193043
Blank Mask and Photomask Using the Same
Application: 18/080,186 →
Publication: US 2024/0192584
Method and Apparatus for Forming a Blank Mask and a Layer for a Blank Mask
Application: 18/081,019 →
Publication: US 2023/0185185
Blank Mask and Photomask Using the Same
Application: 18/092,179 →
Publication: US 2023/0213849
Method of Preparing Wear-Resistant Coating Layer Comprising Metal Matrix Composite and Coating Layer Prepared Thereby
Patent: 8,486,496 →
Application: 11/911,416 →
Publication: US 2008/0220234
Composition for Semiconductor Processing and Method for Polishing Substrate Using the Same
Application: 16/884,420 →
Publication: US 2021/0371701
Classifying and Purifying Apparatus of Solid Blowing Agents and Methods of Classifying and Purifying Solid Blowing Agents
Application: 16/953,403 →
Publication: US 2021/0154705
Polishing Pad, Method for Manufacturing Polishing Pad, and Polishing Method Applying Polishing Pad
Application: 16/584,145 →
Publication: US 2021/0094144
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 9, 2019
From: HWANG, SUNG SIC; LEE, JAE BUM; OH, JUN ROK; MIN, KYOUNG YEOL
To: SKC SOLMICS CO., LTD.
Reel/Frame 050009/0275 →
Assignment of Assignor's Interest Aug 9, 2019
From: HWANG, SUNG SIC; LEE, JAE BUM; OH, JUN ROK; MIN, KYOUNG YEOL
To: SKC SOLMICS CO., LTD.
Reel/Frame 050010/0496 →
Assignment of Assignor's Interest Sep 26, 2019
From: AHN, JAEIN; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 050504/0640 →
Assignment of Assignor's Interest Mar 1, 2021
From: SKC CO., LTD.
To: SKC SOLMICS CO., LTD.
Reel/Frame 055439/0798 →
Assignment of Assignor's Interest Jan 3, 2022
From: LEE, HYUNG-JOO; RYU, JIYEON; KIM, KYUHUN; SHIN, INKYUN
To: SKC SOLMICS CO., LTD.
Reel/Frame 058529/0117 →
Assignment of Assignor's Interest Jan 3, 2022
From: LEE, HYUNG-JOO; KIM, KYUHUN; RYU, JIYEON; SHIN, INKYUN
To: SKC SOLMICS CO., LTD.
Reel/Frame 058530/0464 →
Assignment of Assignor's Interest Apr 26, 2022
From: LEE, GEONGON; CHO, HAHYEON; SHIN, INKYUN; KIM, SEONG YOON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060993/0016 →
Assignment of Assignor's Interest Apr 26, 2022
From: JEONG, MIN GYO; KIM, SEONG YOON; SON, SUNG HOON; SHIN, INKYUN
To: SKC SOLMICS CO., LTD.
Reel/Frame 059803/0526 →
Assignment of Assignor's Interest Apr 29, 2022
From: LEE, GEONGON; CHOI, SUK YOUNG; LEE, HYUNG-JOO; SON, SUNG HOON
To: SKC SOLMICS CO., LTD.
Reel/Frame 059708/0890 →
Assignment of Assignor's Interest May 20, 2022
From: LEE, GEONGON; CHOI, SUK YOUNG; LEE, HYUNG-JOO; SON, SUNG HOON
To: SKC SOLMICS CO., LTD.
Reel/Frame 059970/0421 →
Assignment of Assignor's Interest May 24, 2022
From: LEE, JUNG NAM; YUN, SUNGHOON; SEO, JANGWON; KWON, TAE KYOUNG
To: SKC SOLMICS CO., LTD.
Reel/Frame 059999/0448 →
Assignment of Assignor's Interest May 24, 2022
From: LEE, JUNG NAM; YUN, SUNGHOON; SEO, JANGWON
To: SKC SOLMICS CO., LTD.
Reel/Frame 059999/0093 →
Assignment of Assignor's Interest Jun 7, 2022
From: LEE, GEONGON; CHOI, SUK YOUNG; LEE, HYUNG-JOO; KIM, SUHYEON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060302/0869 →
Assignment of Assignor's Interest Jul 7, 2022
From: HONG, SEUNG CHUL; HAN, DEOK SU; LIM, JIN HYUK; KIM, DONGHYUN
To: SKC SOLMICS CO., LTD.; SK HYNIX INC.
Reel/Frame 060430/0456 →
Assignment of Assignor's Interest Jul 12, 2022
From: LEE, GEONGON; CHOI, SUK YOUNG; LEE, HYUNG-JOO; KIM, SUHYEON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060635/0615 →
Assignment of Assignor's Interest Aug 10, 2022
From: HWANG, SUNGSIC; OH, JUNROK; MIN, KYUNGYEOL; KIM, KYUNGIN
To: SKC SOLMICS CO., LTD.
Reel/Frame 060770/0067 →
Assignment of Assignor's Interest Aug 10, 2022
From: HWANG, SUNGSIC; OH, JUNROK; MIN, KYUNGYEOL; KIM, KYUNGIN
To: SKC SOLMICS CO., LTD.
Reel/Frame 061141/0039 →
Assignment of Assignor's Interest Aug 16, 2022
From: KIM, TAEWAN; LEE, GEONGON; CHOI, SUK YOUNG; KIM, SUHYEON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060819/0148 →
Assignment of Assignor's Interest Aug 30, 2022
From: LEE, GEONGON; CHOI, SUK YOUNG; LEE, HYUNG-JOO; SON, SUNG HOON
To: SKC SOLMICS CO., LTD.
Reel/Frame 060940/0977 →
Assignment of Assignor's Interest Mar 13, 2023
From: HWANG, SUNG SIC; LEE, JAE BUM; OH, JUN ROK; MIN, KYOUNG YEOL
To: SKC SOLMICS CO., LTD.
Reel/Frame 062963/0038 →
Assignment of Assignor's Interest Mar 13, 2023
From: HONG, SEUNG CHUL; HAN, DEOK SU; KIM, HWAN CHUL; PARK, HAN TEO
To: SKC SOLMICS CO., LTD.
Reel/Frame 062963/0153 →
Assignment of Assignor's Interest May 23, 2024
From: SK ENPULSE CO.
To: SOLMICS CO., LTD.
Reel/Frame 067502/0481 →
Corrective Assignment to Correct the the Assignor's Name from Sk Enpulse Co. to Sk Enpulse Co., Ltd Previously Recorded at Reel: 67502 Frame: 481. Assignor(S) Hereby Confirms the Assignment. May 28, 2024
From: SK ENPULSE CO., LTD.
To: SOLMICS CO., LTD.
Reel/Frame 067555/0822 →
Nunc Pro Tunc Assignment Jun 10, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071370/0877 →
Assignment of Assignor's Interest Feb 5, 2026
From: SK ENPULSE CO., LTD.
To: LUMINAMASK CO., LTD.
Reel/Frame 074478/0876 →