Patent Assignment
Reel/Frame 062963/0153
Assignment of Assignor's Interest
Recorded: 2023-03-13
Pages: 4
Assignors
HONG, SEUNG CHUL
Executed: 2021-12-30
HAN, DEOK SU
Executed: 2021-12-30
KIM, HWAN CHUL
Executed: 2021-12-30
PARK, HAN TEO
Executed: 2021-12-30
LEE, HYEONG JU
Executed: 2021-12-30
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Process Polishing Composition and Polishing Method of Substrate Applied with Polishing Composition
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.