IP Library Assignment 073948/0075
Patent Assignment
Reel/Frame 073948/0075

Assignment of Assignor's Interest

Recorded: 2026-03-03 Pages: 5
Assignor
SK ENPULSE CO., LTD.
Executed: 2026-01-26
Assignee
YCCHEM CO., LTD.
174-12 YUSEORI-GIL, SEONNAM-MYEON, GYEONGSANGBUK-DO, SEONGJU-GUN, KOREA, REPUBLIC OF
Covered Properties (13)
Composition for Semiconductor Processing and Manufacturing Method of Semiconductor Device Using the Same
Application: 18/297,260 →
Publication: US 2023/0332017
Polishing Composition for Semiconductor Processing and Method of Polishing a Substrate
Application: 18/403,539 →
Publication: US 2024/0218251
Polishing Composition for Semiconductor Process and Method for Polishing a Substrate Using the Same
Application: 18/404,979 →
Publication: US 2024/0274439
Polishing Composition for Semiconductor Process and Polishing Method of Substrate Using the Same
Application: 18/901,750 →
Publication: US 2025/0115786
Polishing Composition for Semiconductor Process and Polishing Method of Substrate Using the Same
Application: 18/901,849 →
Publication: US 2025/0115787
Polishing Composition for Semiconductor Process and Method of Manufacturing Substrate Using Same
Application: 18/926,638 →
Publication: US 2025/0136842
Polishing Composition for Semiconductor Process and Method of Manufacturing Substrate Using Same
Application: 18/934,667 →
Publication: US 2025/0145857
Polishing Composition for Semiconductor Process and Method for Polishing Substrate Using Same
Application: 19/369,789 →
Polishing Composition for Semiconductor Process and Substrate Polishing Method Using the Same
Application: 19/441,574 →
Polishing Composition for Semiconductor Process and Substrate Polishing Method Using the Same
Application: 19/446,275 →
Composition for Semiconductor Processing and Method for Polishing Substrate Using the Same
Application: 16/884,420 →
Publication: US 2021/0371701
Semiconductor Process Polishing Composition and Polishing Method of Substrate Applied with Polishing Composition
Application: 17/563,499 →
Publication: US 2022/0208552
Composition for Semiconductor Processing and Polishing Method of Semiconductor Device Using the Same
Application: 18/297,152 →
Publication: US 2023/0332016
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 27, 2020
From: LEE, HYEONGJU
To: SKC CO., LTD.
Reel/Frame 052760/0880 →
Assignment of Assignor's Interest Mar 1, 2021
From: SKC CO., LTD.
To: SKC SOLMICS CO., LTD.
Reel/Frame 055439/0798 →
Assignment of Assignor's Interest Mar 13, 2023
From: HONG, SEUNG CHUL; HAN, DEOK SU; KIM, HWAN CHUL; PARK, HAN TEO
To: SKC SOLMICS CO., LTD.
Reel/Frame 062963/0153 →
Assignment of Assignor's Interest Apr 7, 2023
From: HAN, DEOK SU; HONG, SEUNG CHUL; PARK, HAN TEO; KIM, HWAN CHUL
To: SK ENPULSE CO., LTD.
Reel/Frame 063257/0889 →
Assignment of Assignor's Interest Apr 7, 2023
From: HONG, SEUNG CHUL; MYUNG, KANGSIK; PARK, HAN TEO; HAN, DEOK SU
To: SK ENPULSE CO., LTD.
Reel/Frame 063260/0578 →
Change of Name Nov 9, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 065509/0991 →
Assignment of Assignor's Interest Jan 3, 2024
From: HONG, SEUNG CHUL; MYUNG, KANGSIK; HAN, DEOK SU; PARK, HAN TEO
To: SK ENPULSE CO., LTD.
Reel/Frame 066011/0367 →
Assignment of Assignor's Interest Jan 5, 2024
From: HAN, DEOK SU; KIM, HWAN CHUL; HONG, SEUNG CHUL; PARK, HAN TEO
To: SK ENPULSE CO., LTD.
Reel/Frame 066028/0064 →
Assignment of Assignor's Interest Sep 30, 2024
From: HAN, DEOK SU; PARK, HAN TEO; CHOI, YONGSOO
To: SK ENPULSE CO., LTD.
Reel/Frame 068742/0143 →
Assignment of Assignor's Interest Sep 30, 2024
From: HAN, DEOK SU
To: SK ENPULSE CO., LTD.
Reel/Frame 068741/0311 →
Assignment of Assignor's Interest Oct 25, 2024
From: PARK, HAN TEO; HAN, DEOK SU; LEE, HYUNG-JOO; CHOI, YONGSOO
To: SK ENPULSE CO., LTD.
Reel/Frame 069018/0963 →
Assignment of Assignor's Interest Nov 1, 2024
From: HAN, DEOK SU
To: SK ENPULSE CO., LTD.
Reel/Frame 069104/0945 →
Assignment of Assignor's Interest Oct 27, 2025
From: HAN, DEOKSU; HONG, SEUNGCHUL
To: SK ENPULSE CO., LTD.
Reel/Frame 073359/0753 →
Assignment of Assignor's Interest Jan 6, 2026
From: HAN, DEOKSU
To: SK ENPULSE CO., LTD.
Reel/Frame 073384/0086 →
Assignment of Assignor's Interest Apr 10, 2026
From: HAN, DEOKSU; LEE, SUNGMIN
To: YCCHEM CO., LTD.
Reel/Frame 074341/0688 →