Patent Assignment
Reel/Frame 052760/0880
Assignment of Assignor's Interest
Recorded: 2020-05-27
Pages: 3
Assignor
LEE, HYEONGJU
Executed: 2020-05-22
Assignee
SKC CO., LTD.
84, JANGAN-RO 309BEON-GIL, JANGAN-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Composition for Semiconductor Processing and Method for Polishing Substrate Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2021
From: SKC CO., LTD.
To: SKC SOLMICS CO., LTD.
Reel/Frame 055439/0798 →
Change of Name
Nov 9, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 065509/0991 →
Assignment of Assignor's Interest
Mar 3, 2026
From: SK ENPULSE CO., LTD.
To: YCCHEM CO., LTD.
Reel/Frame 073948/0075 →