Patent Assignment
Reel/Frame 055439/0798
Assignment of Assignor's Interest
Recorded: 2021-03-01
Pages: 3
Assignor
SKC CO., LTD.
Executed: 2021-02-25
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF
Covered Properties
(4)
Polishing Pad, Method for Manufacturing Polishing Pad, and Polishing Method Applying Polishing Pad
Polishing Pad, Method for Manufacturing Polishing Pad, and Polishing Method Applying Polishing Pad
Composition for Semiconductor Processing and Method for Polishing Substrate Using the Same
Classifying and Purifying Apparatus of Solid Blowing Agents and Methods of Classifying and Purifying Solid Blowing Agents
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 26, 2019
From: AHN, JAEIN; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 050505/0351 →
Assignment of Assignor's Interest
Sep 26, 2019
From: AHN, JAEIN; SEO, JANG WON; YUN, JONG WOOK; YUN, SUNGHOON
To: SKC CO., LTD.
Reel/Frame 050504/0640 →
Assignment of Assignor's Interest
May 27, 2020
From: LEE, HYEONGJU
To: SKC CO., LTD.
Reel/Frame 052760/0880 →
Assignment of Assignor's Interest
Nov 20, 2020
From: YUN, SUNGHOON; LEE, JUNG NAM; KWON, TAE KYOUNG; SEO, JANG WON
To: SKC CO., LTD.
Reel/Frame 054425/0826 →
Change of Name
Nov 9, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 065509/0991 →
Nunc Pro Tunc Assignment
Jun 10, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071370/0877 →
Assignment of Assignor's Interest
Mar 3, 2026
From: SK ENPULSE CO., LTD.
To: YCCHEM CO., LTD.
Reel/Frame 073948/0075 →