Patent Assignment
Reel/Frame 066011/0367
Assignment of Assignor's Interest
Recorded: 2024-01-03
Pages: 5
Assignors
HONG, SEUNG CHUL
Executed: 2023-12-20
MYUNG, KANGSIK
Executed: 2023-12-20
HAN, DEOK SU
Executed: 2023-12-21
PARK, HAN TEO
Executed: 2023-12-20
CHOI, YONGSOO
Executed: 2023-12-22
Assignee
SK ENPULSE CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Composition for Semiconductor Processing and Method of Polishing a Substrate
Application:
18/403,539 →
Publication:
US 2024/0218251
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.