Composition for semiconductor processing and manufacturing method of semiconductor device using the same
A composition for semiconductor processing includes abrasive particles, and a dishing control additive, comprising a first dishing control additive and a second dishing control additive. The first dishing control additive includes a compound having a betaine group and a salicylic group or a derivative thereof, and the second dishing control additive includes an azole-based compound. The first dishing control additive includes 0.07 parts by weight or more based on 100 parts by weight of the abrasive particles, and the second dishing control additive includes 0.13 parts by weight or less based on 100 parts by weight of the abrasive particles.
1 . A composition for semiconductor processing comprising:
abrasive particles; and
a dishing control additive, comprising a first dishing control additive and a second dishing control additive,
wherein the first dishing control additive comprises a compound having a betaine group and a salicylic group or a derivative thereof, and the second dishing control additive comprises an azole-based compound,
the first dishing control additive comprises 0.07 parts by weight or more based on 100 parts by weight of the abrasive particles, and
the second dishing control additive comprises 0.13 parts by weight or less based on 100 parts by weight of the abrasive particles.
2 . The composition of claim 1 ,
wherein the composition has a value according to Expression 1 below from 0.4 to 0.7,
( C BS −0.05)+ C AZ ×5, [Expression 1]
where C BS is parts by weight of the first dishing control additive based on 100 parts by weight of the abrasive particles, and C AZ is parts by weight of the second dishing control additive based on 100 parts by weight of the abrasive particles.
3 . The composition of claim 1 ,
wherein the first dishing control additive and the second dishing control additive are comprised in a weight ratio of 1:0 to 0.95.
4 . The composition of claim 1 , wherein the composition comprises 3% by weight or more of the abrasive particles based on a total weight of the composition for semiconductor processing.
5 . The composition of claim 1 ,
further comprising an organic acid,
wherein the organic acid comprises a citric acid.
6 . A composition for semiconductor processing comprising:
abrasive particles; and
a dishing control additive, comprising a first dishing control additive including a compound from a betaine group and a salicylic group or a derivative thereof, and a second dishing control additive of an azole-based compound, wherein
the composition has a value according to Expression 2 from 4 to 7,
( C P −5)×{( C BS −0.05)+ C AZ ×5}, [Expression 2]
where C P is parts by weight of the abrasive particles based on 100 parts by weight of the composition for semiconductor processing, C BS is parts by weight of the first dishing control additive based on 100 parts by weight of the abrasive particles, and C AZ is parts by weight of the second dishing control additive based on 100 parts by weight of the abrasive particles.
7 . The composition of claim 6 , further comprising an organic acid and a polymer compound including a halogen group,
wherein the polymer compound comprises 0.5 parts by weight or less based on 1 part by weight of the organic acid.
8 . The composition of claim 6 , wherein a ratio between a polishing rate for an insulating film and a polishing rate for a barrier film is 1:0.45 to 0.7.
9 . The composition of claim 6 , wherein a ratio between a polishing rate for an insulating film and a polishing rate for a conductive film is 1:0.85 to 1.2.
10 . The composition of claim 6 ,
wherein the composition polishes a substrate having a through via,
the substrate includes an insulating film, a conductive film, and a barrier film on a surface thereof, and
the conductive film has a polishing rate of 3,800 angstroms/min or more.
11 . A method of manufacturing a semiconductor device, comprising:
preparing a platen on which a polishing pad is mounted and a carrier accommodating a substrate having a through via; and
polishing a surface of the substrate with a composition, using a polishing surface of the polishing pad, by rotating either one or both of the platen and the carrier,
wherein the substrate comprises an insulating film, a conductive film, and a barrier film,
the composition comprises abrasive particles and a dishing control additive, comprising a first dishing control additive and a second dishing control additive,
the first dishing control additive comprises a compound having a betaine group and a salicylic group or a derivative thereof, and the second dishing control additive comprises an azole-based compound,
the first dishing control additive comprises 0.07 parts by weight or more based on 100 parts by weight of the abrasive particles, and
the second dishing control additive comprises 0.13 parts by weight or less based on 100 parts by weight of the abrasive particles.
12 . The method of claim 11 ,
wherein the composition has a value according to Expression 1 below from 0.4 to 0.7,
( C BS −0.05)+ C AZ ×5, [Expression 1]
where C BS is parts by weight of the first dishing control additive based on 100 parts by weight of the abrasive particles, and C AZ is parts by weight of the second dishing control additive based on 100 parts by weight of the abrasive particles.
13 . The method of claim 11 ,
wherein the first dishing control additive and the second dishing control additive are comprised in a weight ratio of 1:0 to 0.95.
14 . The method of claim 11 ,
wherein the composition comprises 3% by weight or more of the abrasive particles based on a total weight of the composition for semiconductor processing.
15 . The method of claim 11 ,
wherein the composition comprises an organic acid, and the organic acid comprises a citric acid.