Assignment of Assignor's Interest

Recorded: 2024-10-25 Pages: 3

Assignors

PARK, HAN TEO

Executed: 2024-10-10

HAN, DEOK SU

Executed: 2024-10-10

LEE, HYUNG-JOO

Executed: 2024-10-10

CHOI, YONGSOO

Executed: 2024-10-14

Assignee

SK ENPULSE CO., LTD.

1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF

Covered Property (1)

Polishing Composition for Semiconductor Process and Method of Manufacturing Substrate Using Same

Application: 18/926,638 →

Publication: US 2025/0136842

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.