IP Library Assignment 060430/0456
Patent Assignment
Reel/Frame 060430/0456

Assignment of Assignor's Interest

Recorded: 2022-07-07 Pages: 5
Assignors
HONG, SEUNG CHUL
Executed: 2022-07-06
HAN, DEOK SU
Executed: 2022-07-06
LIM, JIN HYUK
Executed: 2022-07-05
KIM, DONGHYUN
Executed: 2022-07-05
LEE, JIEUN
Executed: 2022-07-05
Assignees
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUP, GYEONGGI-DO, ICHEON-SI, 17336, KOREA, REPUBLIC OF
Covered Property (1)
Polishing Composition for Semiconductor Process and Manufacturing Method for Polished Article
Application: 17/859,301 →
Publication: US 2023/0019730
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 9, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 065509/0991 →
Assignment of Assignor's Interest Mar 12, 2026
From: SK ENPULSE CO., LTD.
To: YCCHEM CO., LTD.
Reel/Frame 074058/0710 →