IP Library Assignment 059999/0448
Patent Assignment
Reel/Frame 059999/0448

Assignment of Assignor's Interest

Recorded: 2022-05-24 Pages: 3
Assignors
LEE, JUNG NAM
Executed: 2022-05-19
YUN, SUNGHOON
Executed: 2022-05-19
SEO, JANGWON
Executed: 2022-05-19
KWON, TAE KYOUNG
Executed: 2022-05-19
Assignee
SKC SOLMICS CO., LTD.
1043, GYEONGGI-DAERO, GYEONGGI-DO, PYEONGTAEK-SI, 17784, KOREA, REPUBLIC OF
Covered Property (1)
Apparatus for Mixing Resin Composition for Manufacturing Polishing Pad and Method of Manufacturing Polishing Pad
Application: 17/751,947 →
Publication: US 2022/0379275
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 9, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 065509/0991 →
Nunc Pro Tunc Assignment Jun 10, 2025
From: SK ENPULSE CO., LTD.
To: ENPULSE CO., LTD.
Reel/Frame 071370/0877 →