IP Library Granted Patent US 12,531,214
Granted Patent B2
US 12,531,214 · App. 17/892,425 · Granted Jan 20, 2026

Manufacturing method of ring-shaped element for etcher

Inventors: Sung Sic Hwang (Seoul, KR); Jae Bum Lee (Pyeongtaek-si, KR); Jun Rok Oh (Seoul, KR); Kyoung Yeol Min (Yongin-si, KR); Kyung In Kim (Hwaseong-si, KR); Jung Kun Kang (Pyeongtaek-si, KR)
Assignee: Solmics Co., Ltd.
H01J37/32642H01J37/244H01J37/3255
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Quick Facts
Patent No.
US 12,531,214
App. No.
17/892,425
Granted
Jan 20, 2026
Kind
B2
Abstract

A manufacturing method of a ring-shaped element for an etcher, comprises a granulation operation comprising i) a slurry manufacturing process of preparing a slurry by mixing a raw material including boron carbide, a sinterability enhancer with a solvent; and ii) a granulation process of drying the slurry to prepare granulated raw material; a molding operation of manufacturing a green body by molding the granulated raw material; a sintering operation of carbonizing and sintering the green body to manufacture a sintered body; a shape operation of shaping the sintered body to a ring-shaped element for an etcher. The sinterability enhancer comprises one selected from the group consisting of carbon, boron oxide and combinations thereof.

Claims (38)

1 . A method of manufacturing a ring-shaped element for an etcher, the method comprising:

preparing a slurry by mixing a raw material comprising boron carbide and a sinterability enhancer with a solvent;

drying the slurry to form a granulated raw material;

molding the granulated raw material to form a green body:

carbonizing and sintering the green body to produce a sintered body; and

shaping the sintered body into the ring-shaped element for the etcher,

wherein the sinterability enhancer comprises carbon, and

wherein the sinterability enhancer is present in the raw material in an amount ranging from 13% to 23% by weight.

2 . The method of claim 1 ,

wherein the carbon comprises at least one selected from the group consisting of a polymer resin, a carbonized form of the polymer resin, and combinations thereof.

3 . The method of claim 1 ,

wherein the sinterablilty enhancer comprises boron oxide and carbon, and

wherein a weight ratio of boron oxide to carbon in the sinterability enhancer ranges from 1:0.8 to 1:4.

4 . The method of claim 3 ,

wherein the raw material comprises from 1% to 9% by weight of boron oxide and from 5% to 15% by weight of carbon.

5 . The method of claim 1 ,

wherein the solvent comprises at least one selected from the group consisting of an alcohol-based substance, water, and combinations thereof, and

wherein the slurry comprises from 60% to 80% by volume of the solvent.

6 . The method of claim 1 ,

wherein the granulation process comprises spraying the slurry to evaporate the solvent and form the granulated raw material.

7 . The method of claim 1 ,

wherein a particle diameter (D 50 ) of the raw material ranges from 0.3 μm to 1.5 μm.

8 . The method of claim 1 ,

wherein the molding operation comprises filling the granulated raw material into a mold and pressing the filled raw material, and

wherein the pressing is performed at a pressure ranging from 100 MPa to 200 MPa.

9 . The method of claim 1 ,

wherein the carbonizing is performed at a temperature ranging from 600° C. to 900° C.

10 . The method of claim 1 ,

wherein the sintering is performed by maintaining a temperature ranging from 1800° C. to 2500° C. for a duration of 10 hours to 20 hours.

11 . The method of claim 1 ,

wherein the sintering operation comprises:

maintaining a temperature from 100° C. to 250° C. for 20 to 40 minutes;

maintaining a temperature from 250° C. to 350° C. for 4 to 8 hours; and

maintaining a temperature from 360° C. to 500° C. for 4 to 8 hours.

12 . The method of claim 1 ,

wherein the sintering is performed under pressureless conditions.

13 . The method of claim 1 ,

wherein the shaping is performed by electrical discharge wire machining.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNOR'S NAME FROM SK ENPULSE CO. TO SK ENPULSE CO., LTD PREVIOUSLY RECORDED AT REEL: 67502 FRAME: 481. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 28, 2024
From: SK ENPULSE CO., LTD.
To: SOLMICS CO., LTD.
Reel/Frame 067555/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2024
From: SK ENPULSE CO.
To: SOLMICS CO., LTD.
Reel/Frame 067502/0481 →
CHANGE OF NAME Recorded Nov 9, 2023
From: SKC SOLMICS CO., LTD.
To: SK ENPULSE CO., LTD.
Reel/Frame 065509/0991 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2023
From: HWANG, SUNG SIC; LEE, JAE BUM; OH, JUN ROK; MIN, KYOUNG YEOL; KIM, KYUNG IN; KANG, JUNG KUN
To: SKC SOLMICS CO., LTD.
Reel/Frame 062963/0038 →
Priority Claims (2)
KR 10-2018-0094196 · Aug 13, 2018 · national
KR 10-2019-0005490 · Jan 16, 2019 · national
Continuity (2)
Continuation 16536602 · Aug 9, 2019
Related Publication 20220406574A1 · Dec 22, 2022
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