Patent Assignment
Reel/Frame 059999/0512
Assignment of Assignor's Interest
Recorded: 2022-05-24
Pages: 6
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2022-05-08
WU, WEI CHENG
Executed: 2022-05-09
HUANG, CHUNG-JEN
Executed: 2022-05-08
HUANG, WEN-TUO
Executed: 2022-05-08
HUNG, YA-CHI
Executed: 2022-05-23
LIN, CHIA-SHENG
Executed: 2022-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Testing Structure for an Integrated Chip Having a High-Voltage Device