Patent Assignment
Reel/Frame 060004/0241
Assignment of Assignor's Interest
Recorded: 2022-05-12
Pages: 7
Assignors
CHOI, JUYOUN
Executed: 2022-02-28
LEE, EUNJUNG
Executed: 2022-02-28
LEE, JUNHO
Executed: 2022-02-28
HA, SEUNGSOO
Executed: 2022-03-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Package-on-Package Including the Same