Patent Assignment
Reel/Frame 060007/0896
Assignment of Assignor's Interest
Recorded: 2022-05-25
Pages: 3
Assignors
KUO, HUNG-YI
Executed: 2022-05-06
HSIEH, CHENG-CHIEH
Executed: 2022-05-09
YEE, KUO-CHUNG
Executed: 2022-05-08
YU, CHEN-HUA
Executed: 2022-05-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof