Patent Assignment
Reel/Frame 060019/0745
Assignment of Assignor's Interest
Recorded: 2022-04-12
Pages: 3
Assignors
LIN, CHUN-HUNG
Executed: 2022-03-25
TSAI, KAO-TSAIR
Executed: 2022-03-25
LIU, CHUNG-HSIEN
Executed: 2022-03-25
GUO, TZ-HAU
Executed: 2022-03-25
CHU, YEN-JUI
Executed: 2022-03-25
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT. CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method of the Same