Patent Assignment
Reel/Frame 060036/0851
Assignment of Assignor's Interest
Recorded: 2022-05-27
Pages: 6
Assignors
YONETSU, MAKI
Executed: 2022-05-18
SUENAGA, SEIICHI
Executed: 2022-05-18
FUJISAWA, SACHIKO
Executed: 2022-05-18
SANO, TAKASHI
Executed: 2022-05-18
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
TOSHIBA MATERIALS CO., LTD.
8, SHINSUGITA-CHO, ISOGO-KU, KANAGAWA, YOKOHAMA-SHI, JAPAN
Covered Property
(1)
Bonded Body, Ceramic Copper Circuit Board, Method for Manufacturing Bonded Body, and Method for Manufacturing Ceramic Copper Circuit Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment
Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MATERIALS CO. LTD.
Reel/Frame 074940/0511 →
Change of Name
Feb 19, 2026
From: TOSHIBA MATERIALS CO. LTD.
To: NITERRA MATERIALS CO., LTD.
Reel/Frame 074941/0803 →
Change of Address
Feb 19, 2026
From: KABUSHIKI KAISHA TOSHIBA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 074941/0846 →