Patent Assignment
Reel/Frame 060039/0348
Assignment of Assignor's Interest
Recorded: 2022-05-27
Pages: 4
Assignors
LIU, MONSEN
Executed: 2022-05-23
TSAI, SHANG-LUN
Executed: 2022-05-23
CHEN, SHUO-MAO
Executed: 2022-05-27
JENG, SHIN-PUU
Executed: 2022-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Double Side Integration Semiconductor Package and Method of Forming the Same