IP Library › Assignment 060069/0163
Patent Assignment
Reel/Frame 060069/0163

Assignment of Assignor's Interest

Recorded: 2022-06-01 Pages: 9
Assignors
ENGELHARDT, NADINE
Executed: 2019-11-29
FLUEGEL, ALEXANDER
Executed: 2019-10-18
ARNOLD, MARCO
Executed: 2019-10-14
EMNET, CHARLOTTE
Executed: 2019-10-16
Assignee
BASF SE
CARL-BOSCH-STRASSE 38, LUDWIGSHAFEN AM RHEIN, 67056, GERMANY
Covered Property (1)
Composition for Copper Bump Electrodeposition Comprising a Leveling Agent
Application: 17/754,097 →
Publication: US 2022/0333262