Patent Assignment
Reel/Frame 060070/0109
Assignment of Assignor's Interest
Recorded: 2022-06-01
Pages: 7
Assignors
CHOI, WON HEE
Executed: 2022-05-24
JANG, SUNG UK
Executed: 2022-05-22
SHIN, DONG SUK
Executed: 2022-05-30
KUH, BONG JIN
Executed: 2022-05-24
LEE, KONG SOO
Executed: 2022-05-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Buffer Layer Structure
Application:
17/829,781 →
Publication:
US 2023/0116342