Patent Assignment
Reel/Frame 060087/0846
Assignment of Assignor's Interest
Recorded: 2022-06-02
Pages: 3
Assignors
LI, CHENG-CHIEH
Executed: 2022-05-31
WU, CHIH-WEI
Executed: 2022-05-31
SHIH, YING-CHING
Executed: 2022-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods of Forming