IP Library › Assignment 060097/0673
Patent Assignment
Reel/Frame 060097/0673

Assignment of Assignor's Interest

Recorded: 2022-06-03 Pages: 4
Assignors
LIN, YU-KAI
Executed: 2022-05-31
SHIH, PO-CHENG
Executed: 2022-05-31
LI, JR-HUNG
Executed: 2022-05-31
LEE, TZE-LIANG
Executed: 2022-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Devices and Methods
Application: 17/831,884 →
Publication: US 2023/0260832