Patent Assignment
Reel/Frame 060098/0740
Assignment of Assignor's Interest
Recorded: 2022-06-03
Pages: 3
Assignor
FAY, OWEN R.
Executed: 2019-12-13
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Three-Dimensional Stacking Semiconductor Assemblies with Near Zero Bond Line Thickness