Patent Assignment
Reel/Frame 060109/0627
Assignment of Assignor's Interest
Recorded: 2022-06-06
Pages: 5
Assignor
GIDUTURI, HARI
Executed: 2022-04-18
Assignee
MICRON TECHNOLOGY, INC.
8000 SO. FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Intra-Package Memory Die Communication Structures