Patent Assignment
Reel/Frame 060111/0843
Assignment of Assignor's Interest
Recorded: 2022-06-06
Pages: 4
Assignors
YEH, WEI-TING
Executed: 2022-03-22
YEN, HUNG-YU
Executed: 2022-03-22
PENG, YU-YUN
Executed: 2022-03-22
LIN, KENG-CHU
Executed: 2022-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metal-Comprising Bottom Isolation Structures