Patent Assignment
Reel/Frame 060122/0409
Assignment of Assignor's Interest
Recorded: 2022-06-07
Pages: 5
Assignors
LIN, YEONG-JYH
Executed: 2020-10-06
LI, CHING I
Executed: 2020-10-07
CHIOU, DE-YANG
Executed: 2020-10-15
CHEN, SZ-FAN
Executed: 2020-10-08
HU, HAN-JUI
Executed: 2020-10-11
WANG, CHING-HUNG
Executed: 2020-10-06
LEE, RU-LIANG
Executed: 2020-10-19
YU, CHUNG-YI
Executed: 2020-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Photolithography Alignment Process for Bonded Wafers