Patent Assignment
Reel/Frame 060122/0417
Assignment of Assignor's Interest
Recorded: 2022-06-07
Pages: 3
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Semiconductor Device Having Plural Stacked First Chips Sealed in a Sealing Portion and a Second Chip Disposed in a Recess Provided in the Sealing Portion