Patent Assignment
Reel/Frame 060126/0642
Assignment of Assignor's Interest
Recorded: 2022-06-07
Pages: 6
Assignors
PARK, SUNGIL
Executed: 2022-05-23
PARK, JAE HYUN
Executed: 2022-05-23
HA, DAEWON
Executed: 2022-05-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Device and Method of Fabricating the Same