Patent Assignment
Reel/Frame 060126/0843
Assignment of Assignor's Interest
Recorded: 2022-06-07
Pages: 3
Assignor
EID, FERAS
Executed: 2017-10-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package with Thermal Interface Material Retaining Structures on Die and Heat Spreader