Patent Assignment
Reel/Frame 060128/0861
Assignment of Assignor's Interest
Recorded: 2022-06-08
Pages: 3
Assignors
WANG, WEI-MING
Executed: 2022-05-18
LIN, YU-HUNG
Executed: 2022-05-18
TAI, SHIH-PENG
Executed: 2022-05-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof