Patent Assignment
Reel/Frame 060143/0619
Assignment of Assignor's Interest
Recorded: 2022-06-08
Pages: 16
Assignors
CHANG, CHIH-WEI
Executed: 2022-06-07
LIN, DA-JUN
Executed: 2022-06-07
CHUNG, YAO-HSIEN
Executed: 2022-06-07
SU, SHIH-WEI
Executed: 2022-06-07
CHANG, HAO-HSUAN
Executed: 2022-06-07
CHIEN, TING-AN
Executed: 2022-06-07
TSAI, BIN-SIANG
Executed: 2022-06-07
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor structure and the forming method thereof