Semiconductor structure and the forming method thereof
The invention provides a semiconductor structure, which comprises a GaN gallium nitride (GaN) layer, an aluminum gallium nitride (AlGaN) layer on the gallium nitride layer, a polarization boost layer on and in direct contact with the aluminum gallium nitride layer, and a gate liner layer on the polarization boost layer.
1. A semiconductor structure, comprising:
a gallium nitride (GaN) layer;
an aluminum gallium nitride (AlGaN) layer located on the gallium nitride layer;
a polarization boost layer located on the aluminum gallium nitride layer and directly contacting the aluminum gallium nitride layer;
a gate liner layer located on the polarization boost layer; and
a groove in the polarization boost layer, and the gate liner layer is partially located in the groove.
2. The semiconductor structure according to claim 1 , wherein the material of the polarization boost layer comprises p-type doped silicon.
3. The semiconductor structure according to claim 1 , wherein the minimum thickness of the polarization boost layer is less than 30 angstroms.
4. The semiconductor structure according to claim 1 , wherein a thickness of the polarization boost layer directly under the groove is less than a thickness of the polarization boost layer beside the groove.
5. The semiconductor structure of claim 1 , further comprising a polarization modification layer located in the groove and between the gate liner layer and the polarization boost layer.
6. The semiconductor structure according to claim 5 , wherein the polarization modification layer comprises silicon, and a carbon concentration in the polarization modification layer is higher than a carbon concentration in the polarization boost layer.
7. The semiconductor structure of claim 1 , wherein the gate liner layer comprises p-type doped gallium nitride.
8. The semiconductor structure of claim 1 , further comprising a dielectric layer on the polarization boost layer, and a part of the gate liner layer covers the dielectric layer.
9. The semiconductor structure according to claim 1 , wherein the polarization boost layer contains doping ions selected from boron, aluminum, gallium, indium and thallium.