Patent Assignment
Reel/Frame 060147/0081
Assignment of Assignor's Interest
Recorded: 2022-06-09
Pages: 10
Assignors
JEON, JINJU
Executed: 2021-12-31
CHUNG, YOUNGWOO
Executed: 2022-05-10
KIM, HANSEOK
Executed: 2021-12-31
JEONG, HEEGEUN
Executed: 2021-12-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Image Sensor with Stack Structure in Which Two Semiconductor Chips Are Combined with Each Other