Patent Assignment
Reel/Frame 060147/0962
Assignment of Assignor's Interest
Recorded: 2022-06-09
Pages: 4
Assignors
YANG, CHING JU
Executed: 2022-02-24
CHEN, HUAN-CHIEH
Executed: 2022-06-07
CHANG, YAO-WEN
Executed: 2022-02-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Memory Device Structure for Reducing Thermal Crosstalk