Patent Assignment
Reel/Frame 060148/0267
Assignment of Assignor's Interest
Recorded: 2022-06-09
Pages: 4
Assignor
BAIK, SEUNGHYUN
Executed: 2022-05-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Comprising Semiconductor Chip with Stepped Portion