Patent Assignment
Reel/Frame 060148/0427
Assignment of Assignor's Interest
Recorded: 2022-06-09
Pages: 5
Assignors
LIN, KAN-JU
Executed: 2022-05-24
CHANG, CHIEN
Executed: 2022-05-24
CHOU, CHIH-SHIUN
Executed: 2022-05-24
CHANG, TAI MIN
Executed: 2022-05-24
TAI, YI-NING
Executed: 2022-05-24
LEE, HONG-MAO
Executed: 2022-05-24
TSAI, YAN-MING
Executed: 2022-05-24
LOH, WEI-YIP
Executed: 2022-05-24
CHIEN, HARRY
Executed: 2022-05-24
CHANG, CHIH-WEI
Executed: 2022-05-25
TSAI, MING-HSING
Executed: 2022-05-24
HUANG, LIN-YU
Executed: 2022-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Forming the Same