Patent Assignment
Reel/Frame 060155/0067
Assignment of Assignor's Interest
Recorded: 2022-06-09
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Including Structure Connecting Frontside and Backside Metal and Method of Manufacturing the Same