Patent Assignment
Reel/Frame 060163/0360
Assignment of Assignor's Interest
Recorded: 2022-06-10
Pages: 4
Assignors
HUANG, CHIEN TA
Executed: 2022-05-22
TSAI, CHUN-YANG
Executed: 2022-05-22
ONG, YI CHING
Executed: 2022-06-08
HUANG, KUO-CHING
Executed: 2022-05-25
CHUANG, HARRY-HAK-LAY
Executed: 2022-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Techniques for Heat Dispersion in 3D Integrated Circuit