Patent Assignment
Reel/Frame 060171/0551
Assignment of Assignor's Interest
Recorded: 2022-06-10
Pages: 7
Assignors
SONG, GYEONGSEOK
Executed: 2022-03-22
KO, KYEONGJOON
Executed: 2022-03-22
PARK, JAEHYUN
Executed: 2022-03-22
BAE, JUNHAN
Executed: 2022-03-22
RYU, JONGJAE
Executed: 2022-03-22
LEE, NAKWON
Executed: 2022-03-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Including High-Speed Device