Patent Assignment
Reel/Frame 060175/0183
Assignment of Assignor's Interest
Recorded: 2022-06-13
Pages: 5
Assignors
HSIEH, MIN-HSUN
Executed: 2019-08-26
LIAO, SHIH-AN
Executed: 2019-08-21
SU, YING-YANG
Executed: 2019-08-21
LIU, HSIN-MAO
Executed: 2019-08-23
WANG, TZU-HSIANG
Executed: 2019-08-26
PU, CHI-CHIH
Executed: 2019-08-21
Assignee
EPISTAR CORPORATION
21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method and Structure for Die Bonding Using Energy Beam
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.