Patent Assignment
Reel/Frame 060175/0732
Change of Name
Recorded: 2022-05-25
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Metal Paste for Joints, Assembly, Production Method for Assembly, Semiconductor Device, and Production Method for Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 17, 2019
From: KAWANA, YUKI; NAKAKO, HIDEO; NEGISHI, MOTOHIRO; ISHIKAWA, DAI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050746/0342 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →