Patent Assignment
Reel/Frame 060177/0867
Assignment of Assignor's Interest
Recorded: 2022-06-13
Pages: 6
Assignors
PARK, SUNGIL
Executed: 2022-05-24
HWANG, KYUMAN
Executed: 2022-05-25
PARK, JAE HYUN
Executed: 2022-05-24
CHOI, DOYOUNG
Executed: 2022-05-27
HA, DAEWON
Executed: 2022-05-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Devices
Application:
17/838,384 →
Publication:
US 2023/0146060