Patent Assignment
Reel/Frame 060199/0916
Assignment of Assignor's Interest
Recorded: 2022-02-28
Pages: 2
Assignor
PARK, CHUL
Executed: 2022-02-17
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including a Bonding Wire Branch Structure