Patent Assignment
Reel/Frame 060217/0392
Assignment of Assignor's Interest
Recorded: 2022-06-16
Pages: 3
Assignors
TSUCHIYA, KEITA
Executed: 2022-06-13
KARIYAZAKI, SHUUICHI
Executed: 2022-06-14
MITAMURA, KAZUHIRO
Executed: 2022-06-13
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOTO-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device Including Wiring Substrate Having Multiple Signal Wirings and Multiple Insulating Layers