Patent Assignment
Reel/Frame 060227/0359
Assignment of Assignor's Interest
Recorded: 2022-06-16
Pages: 7
Assignors
TSAI, MIN-YING
Executed: 2019-12-30
WU, CHENG-TA
Executed: 2019-12-30
TU, YEUR-LUEN
Executed: 2020-01-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Conductive Contact for Ion Through-Substrate Via