IP Library Assignment 060228/0821
Patent Assignment
Reel/Frame 060228/0821

Assignment of Assignor's Interest

Recorded: 2022-06-16 Pages: 8
Assignors
CHUAH, TIN POAY
Executed: 2022-06-03
KU, JEFF
Executed: 2022-06-07
LIM, MIN SUET
Executed: 2022-06-01
LIM, YEW SAN
Executed: 2022-06-03
LOO, TWAN SING
Executed: 2022-06-07
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Interconnection Structure with Liquid Metal and Surface Pins and Removable Magnet or Guideposts Aligment Around Package Substrate
Application: 17/834,674 →
Publication: US 2023/0395480